Feature: Excellent wetting and high reliability. Can effectively prevent the collapse of the printing and preheat. Viscous force lasting, not easy to dry. Colorless, does not affect the test, fine-clean and cleaning performance. White and plump solder joint. No false welding, strong adhesive with solder iron tip. Products wetting, anti-dry and strong, long shelf life at room temperature. Suitable for: mobile phone repair industry, computer digital service industries. Used to high-precision circuit board soldering SMT, BGA soldering processes, etc. Specification: Alloy: Sn63/Pb37 Microns: 25-45um Package Included: 1 * Solder Paste 50g